In an ancient thread which was recently hijacked....
We can hopefully agree that (in both cases under fault conditions) ‘earthing’ is used to facilitate ADS and that ‘bonding’ is used to minimise potential differences, essentially ‘touch voltages’. Bonding should minimise potential ‘touch voltages’, whilst (via ADS) earthing should limit (to a few seconds at most) the duration of potentially dangerous touch voltages, should they arise (as well as offer protection against fire etc.).
With Main Bonding, we (and the regs) rely on the presence of an adequate bonding conductor to minimise the potential differences that can exist between exposed conductors within the premises (i.e. to create an 'equipotential zone’).
With Supplementary Bonding, we (and the regs) presumably could again rely on the presence of the bonding conductor to prevent significant potential differences between simultaneously touchable parts - but the regs don’t seem to take that approach. Instead, they specify (in 415.2.2) a test of “the effectiveness of the supplementary bonding” which is based on the requirement that a voltage difference of 50V or greater between simultaneously touchable parts would result in disconnection of the supply by a protective device. Even though the motivation to is limit the duration of persistence dangerous touch voltages, that sounds to me like ADS - in fact, more demanding than the usual ADS (which only requires disconnection if the potential of exposed-c-ps rises to full mains voltage).
Since the regs indicate that the adequacy of supplementary bonding is to be judged in relation to 'ADS', I can well see that some of those who have a degree of understanding of the difference between the concepts of earthing and bonding may well find themselves more than a little confused!
ADS obviously doesn’t come into Main Bonding (even though I’m sure it would be easy enough to produce a protective device which disconnected the supply if current in the MPB conductor rose above some threshold) but I am a little surprised that the regs don’t seem to impose any requirement/test in relation to the “effectiveness” of MPB (in the way they do for supplementary bonding), other than to impose a minimum CSA for the bonding conductor (which is probably mainly to ensure that it doesn't melt). With supplementary bonding, even if the CSA of the bonding conductor is compliant with the regs, they still specify a ‘test of its effectiveness’. In the case of main bonding, although there is guidance (elsewhere) suggesting a maximum MPB conductor resistance of 0.05 Ω, AFAIAA, the regs themselves have no ‘requirements’ beyond that of CSA, and specify no 'tests'.
Any thoughts/comments?
Kind Regards, John
The concepts are, indeed, totally different, but for those who are already confused/uncertain about the difference, I can see them having a particular problem with supplementary bonding....earthed equipotential bonding does not imply that there is a such thing as "earth bonding". There isn't any such thing, nor was there ever any such thing. Earthing and bonding are completely different concepts.
We can hopefully agree that (in both cases under fault conditions) ‘earthing’ is used to facilitate ADS and that ‘bonding’ is used to minimise potential differences, essentially ‘touch voltages’. Bonding should minimise potential ‘touch voltages’, whilst (via ADS) earthing should limit (to a few seconds at most) the duration of potentially dangerous touch voltages, should they arise (as well as offer protection against fire etc.).
With Main Bonding, we (and the regs) rely on the presence of an adequate bonding conductor to minimise the potential differences that can exist between exposed conductors within the premises (i.e. to create an 'equipotential zone’).
With Supplementary Bonding, we (and the regs) presumably could again rely on the presence of the bonding conductor to prevent significant potential differences between simultaneously touchable parts - but the regs don’t seem to take that approach. Instead, they specify (in 415.2.2) a test of “the effectiveness of the supplementary bonding” which is based on the requirement that a voltage difference of 50V or greater between simultaneously touchable parts would result in disconnection of the supply by a protective device. Even though the motivation to is limit the duration of persistence dangerous touch voltages, that sounds to me like ADS - in fact, more demanding than the usual ADS (which only requires disconnection if the potential of exposed-c-ps rises to full mains voltage).
Since the regs indicate that the adequacy of supplementary bonding is to be judged in relation to 'ADS', I can well see that some of those who have a degree of understanding of the difference between the concepts of earthing and bonding may well find themselves more than a little confused!
ADS obviously doesn’t come into Main Bonding (even though I’m sure it would be easy enough to produce a protective device which disconnected the supply if current in the MPB conductor rose above some threshold) but I am a little surprised that the regs don’t seem to impose any requirement/test in relation to the “effectiveness” of MPB (in the way they do for supplementary bonding), other than to impose a minimum CSA for the bonding conductor (which is probably mainly to ensure that it doesn't melt). With supplementary bonding, even if the CSA of the bonding conductor is compliant with the regs, they still specify a ‘test of its effectiveness’. In the case of main bonding, although there is guidance (elsewhere) suggesting a maximum MPB conductor resistance of 0.05 Ω, AFAIAA, the regs themselves have no ‘requirements’ beyond that of CSA, and specify no 'tests'.
Any thoughts/comments?
Kind Regards, John